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  ? semiconductor components industries, llc, 2004 march, 2004 ? rev. 4 1 publication order number: MMBV3401LT1/d MMBV3401LT1 preferred device silicon pin diode this device is designed primarily for vhf band switching applications but is also suitable for use in general?purpose switching circuits. supplied in a surface mount package. features ? rugged pin structure coupled with wirebond construction for optimum reliability ? low capacitance ? 0.7 pf (typ) at v r = 20 vdc ? very low series resistance at 100 mhz ? 0.34 ohms (typ) @ i f = 10 madc maximum ratings rating symbol value unit reverse voltage v r 35 vdc forward power dissipation @ t a = 25 c derate above 25 c p d 200 2.0 mw mw/ c junction temperature t j +125 c storage temperature range t stg ?55 to +150 c http://onsemi.com preferred devices are recommended choices for future use and best overall value. device package shipping 2 ordering information MMBV3401LT1 sot?23 3000/tape & reel marking diagram 4d d 2for information on tape and reel specifications, including part orientation and tape sizes, please refer to our tape and reel packaging specifications brochure, brd8011/d. 3 cathode 1 anode 1 2 3 sot?23 (to ?236ab) case 318 style 8 4d = specific device code d = date code
MMBV3401LT1 http://onsemi.com 2 electrical characteristics (t a = 25 c unless otherwise noted) characteristic symbol min typ max unit reverse breakdown voltage (i r = 10 m adc) v (br)r 35 ? ? vdc diode capacitance (v r = 20 vdc) c t ? ? 1.0 pf series resistance (figure 1) (i f = 10 madc, f = 100 mhz) r s ? ? 0.7 w reverse leakage current (v r = 25 vdc) i r ? ? 0.1 m adc
MMBV3401LT1 http://onsemi.com 3 typical characteristics figure 1. series resistance figure 2. forward voltage v f , forward voltage (volts) figure 3. diode capacitance t a , ambient temperature ( c) figure 4. leakage current 0.5 50 40 1.0 , reverse current ( a) 100 -60 0.01 0.001 0 +100 v r = 25 vdc +140 +60 +20 -20 i r 0.1 1.0 10 1.6 1.2 0.8 0.4 0 0 4.0 12 14 16 i f , forward current (ma) r s , series resistance (ohms) 1.4 1.0 0.6 0.2 t a = 25 c 2.0 6.0 8.0 10 30 20 10 0 0.8 0.6 0.9 0.7 i f , forward current (ma) t a = 25 c v r , reverse voltage (volts) 0 20 2.0 10 -15 +3.0 7.0 5.0 1.0 0.5 0.7 0.2 -3.0 -18 -6.0 -21 -9.0 -24 -12 -27 t a = 25 c c t , diode capacitance (pf) m 0.04 0.004 4.0 40 0.4
MMBV3401LT1 http://onsemi.com 4 package dimensions sot?23 (to?236) case 318?08 issue ai *for additional information on our pb?free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* d j k l a c b s h g v 3 1 2 dim a min max min max millimeters 0.1102 0.1197 2.80 3.04 inches b 0.0472 0.0551 1.20 1.40 c 0.0350 0.0440 0.89 1.11 d 0.0150 0.0200 0.37 0.50 g 0.0701 0.0807 1.78 2.04 h 0.0005 0.0040 0.013 0.100 j 0.0034 0.0070 0.085 0.177 k 0.0140 0.0285 0.35 0.69 l 0.0350 0.0401 0.89 1.02 s 0.0830 0.1039 2.10 2.64 v 0.0177 0.0236 0.45 0.60 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. maximum lead thickness includes lead finish thickness. minimum lead thickness is the minimum thickness of base material. 4. 318?03 and ?07 obsolete, new standard 318?08. style 8: pin 1. anode 2. no connection 3. cathode  mm inches  scale 10:1 0.8 0.031 0.9 0.035 0.95 0.037 0.95 0.037 sot?23 2.0 0.079 on semiconductor and are registered trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to mak e changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for an y particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, in cluding without limitation special, consequential or incidental damages. atypicalo parameters which may be provided in scillc data sheets and/or specifications can and do vary in different a pplications and actual performance may vary over time. all operating parameters, including atypicalso must be validated for each customer application by customer's technical e xperts. scillc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the scillc prod uct could create a situation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indem nify and hold scillc and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney f ees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was neglig ent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. publication ordering information n. american technical support : 800?282?9855 toll free usa/canada japan : on semiconductor, japan customer focus center 2?9?1 kamimeguro, meguro?ku, tokyo, japan 153?0051 phone : 81?3?5773?3850 MMBV3401LT1/d literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303?675?2175 or 800?344?3860 toll free usa/canada fax : 303?675?2176 or 800?344?3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : http://onsemi.com order literature : http://www.onsemi.com/litorder for additional information, please contact your local sales representative.


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